The **ATS-06B-36-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **heat sink** manufactured by Advanced Thermal Solutions (ATS) as part of their "push pin" series. ### 1. Technical Specifications The part is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 14.82°C/W (Unducted Flow @ 200 LFM) | | **Dimensions** | 35.00mm x 35.00mm x 15.00mm | | **Fin Style** | Straight Fin | --- ### 2. Physical Components & Electronic Role While the part itself is passive (no electricity flows through it), it is critical for the survival of active electronic circuits: * **Heat Sink Body:** The 35mm x 35mm aluminum block provides the surface area necessary to transfer heat from the semiconductor die to the ambient air. * **Thermal Interface Material (TIM):** This part usually comes with **T766** pre-applied. This is a phase-change material that fills microscopic air gaps between the chip and the heat sink to maximize thermal conductivity. * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses mechanical brass pins. This is preferred in high-vibration environments (like industrial servers) to ensure the heat sink does not shift or fall off. --- ### 3. Thermal Performance Profile The efficiency of this electronic part depends heavily on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 14.82 | | 300 (1.5 m/s) | 5.96 | | 500 (2.5 m/s) | 4.48 | | 700 (3.5 m/s) | 3.77 | --- ### 4. Part Number Breakdown The suffixing in the part number provides specific manufacturing details: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **06:** Series/Fin Height configuration. * **36:** Specific footprint dimensions. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision or packaging standard.