The **ATS-06B-34-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic surface-mount components. Below is a detailed breakdown of its specifications and electronic characteristics. --- ### 1. Technical Specifications This part belongs to the **pushPIN™** series by Advanced Thermal Solutions (ATS). | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-06B-34-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 6.73°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 35mm x 35mm x 25mm | | **TIM (Thermal Interface Material)** | T766 (High Performance) | --- ### 2. Key Electronic Components While the heatsink itself is mechanical, its design is dictated by the electronic requirements of the PCB it populates: #### A. Thermal Performance (The "C2" Rating) The "C2" in the part number indicates a specific thermal performance profile. It is engineered to dissipate heat from high-speed processors or power components to prevent **thermal throttling** or hardware failure. #### B. The pushPIN™ Attachment System Instead of using messy adhesives or permanent solder, this part uses a spring-loaded mechanism: * **Compression Springs:** Ensure even pressure across the electronic chip (die) for maximum heat transfer. * **Plastic/Brass Push Pins:** Designed to fit into pre-drilled holes on the PCB (typically 3.175mm holes). #### C. Thermal Interface Material (TIM) The base of the ATS-06B-34-C2-R0 comes pre-applied with **T766 phase-change material**. This is a critical "electronic part" that fills microscopic air gaps between the heatsink and the component, significantly lowering the contact resistance. --- ### 3. Application Use Cases This specific heatsink size and height (25mm) are commonly found in: * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Voltage regulators and MOSFET arrays that require active or passive airflow. --- ### 4. Airflow Performance Table Thermal resistance changes based on the velocity of air (measured in Linear Feet per Minute - LFM) provided by system fans: | Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 6.73 | 2.22 | 1.43 |