The **ATS-06B-30-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and physical characteristics. --- ### 1. Technical Specifications This part is manufactured by **Advanced Thermal Solutions Inc.** and belongs to the **pushPIN™** series. | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-06B-30-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded bolts) | | **Thermal Resistance** | 5.31°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions The physical footprint of the heatsink determines its compatibility with specific PCB layouts. | Dimension | Measurement | | :--- | :--- | | **Length/Width** | 35.00 mm x 35.00 mm | | **Height** | 25.00 mm | | **Pitch (Hole spacing)** | 28.50 mm | | **Weight** | ~45 grams | --- ### 3. Key Features and Components * **Fin Design:** It features a **Straight Fin** pattern. This design is optimized for high-performance air cooling in environments where airflow is directed through the fins. * **pushPIN™ Attachment:** Instead of messy adhesives or fragile clips, this part uses a push-pin mechanism with a precise compression spring. This ensures even pressure across the chip surface for maximum heat transfer. * **Blue Anodized Finish:** The coating is not just for aesthetics; anodizing increases the surface emissivity, slightly improving radiative cooling and providing corrosion resistance. * **T766 TIM:** It comes with a pre-applied high-performance Thermal Interface Material. This eliminates the need for external thermal paste and ensures a reliable bond between the component and the heatsink. --- ### 4. Typical Applications * **CPUs/GPUs:** Cooling small-form-factor processors. * **FPGAs:** Managing heat in field-programmable gate arrays. * **Power Supplies:** Cooling MOSFETs or power regulators. * **Telecommunications:** Used in routers and switches where constant uptime requires stable temperatures.