ATS-06B-29-C2-R0
AI

The **ATS-06B-29-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic devices like CPUs, GPUs, or FPGAs.
---
### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Thermal Resistance** | 7.57 °C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 20mm |
| **Material** | Aluminum |
| **Fin Style** | Straight Fin |
| **Attachment Method** | Push-Pin (Brass/Plastic options) |
| **Color/Finish** | Blue Anodized |
---
### 2. Design and Components
The part is engineered for precision cooling in air-forced environments. Its "electronic parts" are defined by its physical engineering:
* **Heat Sink Base:** A 45mm x 45mm flat surface that makes direct contact with the electronic chip (usually via Thermal Interface Material).
* **Fins:** These are vertical protrusions that increase the surface area to allow air to carry away heat.
* **Push-Pin Mechanism:** Instead of adhesive, it uses a spring-loaded push-pin system. This ensures consistent pressure and secure mounting on the PCB (Printed Circuit Board) through pre-drilled holes.
* **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied high-performance thermal pad or grease to ensure maximum heat transfer.
---
### 3. Usage Context
This component is used in environments where heat management is critical for the lifespan of semiconductors:
1. **Telecommunications:** Cooling routers and switches.
2. **Power Electronics:** Managing heat in power converters.
3. **Industrial Controls:** Cooling processors in high-temperature factory settings.
---
### 4. Thermal Performance Comparison
Thermal performance varies based on air flow (measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 | 7.57 |
| 300 | 2.55 |
| 500 | 1.63 |
| 700 | 1.33 |
- ⤷
How does the push-pin mounting system compare to adhesive tapes?
- ⤷ What are the recommended hole sizes for the PCB when using this heat sink?
- ⤷ Can this heat sink be used with custom thermal interface materials?