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  • ATS-06B-29-C2-R0

  • AI
    The **ATS-06B-29-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic devices like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Thermal Resistance** | 7.57 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Material** | Aluminum | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Brass/Plastic options) | | **Color/Finish** | Blue Anodized | --- ### 2. Design and Components The part is engineered for precision cooling in air-forced environments. Its "electronic parts" are defined by its physical engineering: * **Heat Sink Base:** A 45mm x 45mm flat surface that makes direct contact with the electronic chip (usually via Thermal Interface Material). * **Fins:** These are vertical protrusions that increase the surface area to allow air to carry away heat. * **Push-Pin Mechanism:** Instead of adhesive, it uses a spring-loaded push-pin system. This ensures consistent pressure and secure mounting on the PCB (Printed Circuit Board) through pre-drilled holes. * **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied high-performance thermal pad or grease to ensure maximum heat transfer. --- ### 3. Usage Context This component is used in environments where heat management is critical for the lifespan of semiconductors: 1. **Telecommunications:** Cooling routers and switches. 2. **Power Electronics:** Managing heat in power converters. 3. **Industrial Controls:** Cooling processors in high-temperature factory settings. --- ### 4. Thermal Performance Comparison Thermal performance varies based on air flow (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 7.57 | | 300 | 2.55 | | 500 | 1.63 | | 700 | 1.33 |
    ✨ Follow-up Questions
    • ⤷ How does the push-pin mounting system compare to adhesive tapes?
    • ⤷ What are the recommended hole sizes for the PCB when using this heat sink?
    • ⤷ Can this heat sink be used with custom thermal interface materials?