The **ATS-06B-196-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series and is designed for electronic cooling applications where space is limited and thermal efficiency is critical. --- ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 18.11°C/W (Unducted Flow @ 100 LFM) | | **Compatibility** | Integrated Circuits (ICs), CPUs, GPUs | --- ### 2. Breakdown of the Model Number The part number can be decoded to understand its specific configurations: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **06:** Series/Type designation. * **B:** Material or Mounting variation. * **196:** Specific size and fin configuration code. * **C2:** Thermal interface material (typically T766) or finish grade. * **R0:** Revision code (Standard). --- ### 3. Key Electronic/Mechanical Features #### A. Thermal Interface Material (TIM) This heat sink typically comes pre-applied with a thermal interface material. This ensures that the microscopic gaps between the heat source (the chip) and the heat sink are filled, maximizing heat transfer. #### B. pushPIN™ Attachment Unlike adhesive-based heat sinks, the pushPIN™ system uses a flexible spring-loaded mechanism. This provides: 1. **Consistent Pressure:** Ensures the heat sink stays flat against the component. 2. **Reliability:** Resistant to vibration and mechanical shock. 3. **Removability:** Can be removed for maintenance without damaging the PCB or the component. #### C. Straight Fin Design The "Straight Fin" geometry is optimized for environments where airflow is directed in a single path. This design minimizes pressure drop while providing a large surface area for heat dissipation. --- ### 4. Typical Applications * **Networking Hardware:** Routers, switches, and gateway devices. * **Industrial PCs:** Compact embedded systems that generate significant heat. * **Consumer Electronics:** High-speed processing units requiring low-profile cooling (10mm height).