The **ATS-06B-16-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, or GPUs. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Thermal Resistance** | 18.08 °C/W (Unducted @ 100 LFM) | | **Dimensions (L x W)** | 54.00 mm x 54.00 mm | | **Height** | 10.00 mm | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ### 2. Design Characteristics This part is engineered for specific thermal management needs: * **Fin Profile (Straight Fin):** The "16" in the part number refers to the fin configuration. Straight fins are ideal for applications with high-speed airflow where low pressure drop is required. * **pushPIN™ Attachment:** Instead of using messy adhesives or fragile clips, this uses a spring-loaded push-pin mechanism. This ensures constant pressure (load) on the component for maximum heat transfer and allows for secure mounting to the PCB. * **Blue Anodized Finish:** The surface treatment is not just for aesthetics; anodizing increases the surface emissivity, slightly improving radiative cooling, and provides corrosion resistance. * **Thermal Interface Material (TIM):** It comes with **T766** pre-applied. This is a phase-change material that fills microscopic air gaps between the chip and the heat sink, significantly reducing thermal resistance. --- ### 3. Application Use Cases This heat sink is typically found in: 1. **Telecommunications:** Cooling high-speed processors in routers or switches. 2. **Industrial PCs:** Thermal management for embedded boards where space (10mm height) is a constraint. 3. **Power Electronics:** Dissipating heat from large MOSFET arrays or power modules. --- ### 4. Thermal Performance Data Thermal resistance varies based on the velocity of the air moving across the fins: | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Resistance (°C/W)** | 18.08 | 8.36 | 4.63 | 3.29 | 2.66 | *Note: Lower °C/W values indicate better cooling performance.*