ATS-06B-159-C1-R0
AI

The **ATS-06B-159-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of the part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Fin Style** | Straight (Fine Pitch) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 10mm |
| **Thermal Resistance** | 10.68°C/W (Unducted Flow @ 200 LFM) |
| **Weight** | 33 grams |
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### 2. Key Design Features
* **pushPIN™ Attachment:** This model uses a specialized attachment system consisting of a spring-loaded pin. This ensures a consistent and secure pressure against the component, improving thermal interface contact.
* **Fin Profile:** It features a **Straight Fin** design. This is ideal for systems with high-velocity airflow (active cooling) as it provides a large surface area with low pressure drop.
* **Thermal Interface Material (TIM):** The "R0" suffix typically denotes that it comes pre-applied with a high-performance thermal pad or grease, simplifying the assembly process.
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### 3. Application Use Cases
This specific heat sink is categorized as a "low profile" solution (only 10mm tall), making it suitable for:
1. **1U Rack Servers:** Where vertical space is extremely limited.
2. **Embedded Systems:** Industrial PCs and small form factor (SFF) devices.
3. **Telecommunications:** Networking switches and routers.
4. **Power Electronics:** Cooling MOSFETs or small power modules.
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### 4. Part Number Breakdown (Nomenclature)
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **06:** Series identifier.
* **B:** Material/Fin type.
* **159:** Specific geometry/sizing code.
* **C1:** Blue Anodized finish.
* **R0:** Revision or Packaging code (often includes TIM).
- ⤷
What is the thermal resistance of this heat sink at different airflow speeds (LFM)?
- ⤷ Does the pushPIN attachment require specific hole patterns on the PCB?
- ⤷ Are there taller versions of this heat sink for better cooling performance?