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  • ATS-06B-159-C1-R0

  • AI
    The **ATS-06B-159-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Fin Style** | Straight (Fine Pitch) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Thermal Resistance** | 10.68°C/W (Unducted Flow @ 200 LFM) | | **Weight** | 33 grams | --- ### 2. Key Design Features * **pushPIN™ Attachment:** This model uses a specialized attachment system consisting of a spring-loaded pin. This ensures a consistent and secure pressure against the component, improving thermal interface contact. * **Fin Profile:** It features a **Straight Fin** design. This is ideal for systems with high-velocity airflow (active cooling) as it provides a large surface area with low pressure drop. * **Thermal Interface Material (TIM):** The "R0" suffix typically denotes that it comes pre-applied with a high-performance thermal pad or grease, simplifying the assembly process. --- ### 3. Application Use Cases This specific heat sink is categorized as a "low profile" solution (only 10mm tall), making it suitable for: 1. **1U Rack Servers:** Where vertical space is extremely limited. 2. **Embedded Systems:** Industrial PCs and small form factor (SFF) devices. 3. **Telecommunications:** Networking switches and routers. 4. **Power Electronics:** Cooling MOSFETs or small power modules. --- ### 4. Part Number Breakdown (Nomenclature) * **ATS:** Manufacturer (Advanced Thermal Solutions). * **06:** Series identifier. * **B:** Material/Fin type. * **159:** Specific geometry/sizing code. * **C1:** Blue Anodized finish. * **R0:** Revision or Packaging code (often includes TIM).
    ✨ Follow-up Questions
    • ⤷ What is the thermal resistance of this heat sink at different airflow speeds (LFM)?
    • ⤷ Does the pushPIN attachment require specific hole patterns on the PCB?
    • ⤷ Are there taller versions of this heat sink for better cooling performance?