ATS-06B-151-C2-R0
AI

The **ATS-06B-151-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series and is designed specifically for cooling electronic components like CPUs, GPUs, and other high-heat surface-mount devices.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific model:
| Property | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 35mm x 35mm x 20mm |
| **Attachment Method** | Push-Pin (Plastic) |
| **Thermal Resistance** | 3.93°C/W (at 200 LFM) |
| **Spring Type** | Compression Spring |
| **Interface Material** | T766 (Thermal Tape/Phase Change) |
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### 2. Key Features
* **Straight Fin Design:** The "151" series features a straight-fin geometry which is ideal for systems with high-velocity airflow in a specific direction.
* **Push-Pin Attachment:** It uses a push-pin mechanism with a brass or plastic pin and a compression spring. This ensures a secure fit and consistent pressure on the component for optimal heat transfer.
* **Pre-Applied Thermal Interface Material (TIM):** The "C2" suffix indicates that it comes with a pre-applied thermal pad, reducing assembly time and ensuring a reliable thermal bond.
* **RoHS Compliant:** The "R0" suffix confirms the part meets environmental standards for hazardous substances.
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### 3. Thermal Performance Data
Performance varies based on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **200 (1.0 m/s)** | 3.93 |
| **400 (2.0 m/s)** | 2.36 |
| **600 (3.0 m/s)** | 1.89 |
| **800 (4.0 m/s)** | 1.63 |
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### 4. Component Usage
This part is typically used in:
1. **Networking Hardware:** Switches and routers where internal airflow is managed by fans.
2. **Industrial PCs:** Cooling embedded processors in compact enclosures.
3. **Power Supplies:** Managing heat for MOSFETs or bridge rectifiers that are surface-mounted.
- ⤷What is the difference between the C1 and C2 thermal interface options?
- ⤷ How do I calculate if this heat sink is sufficient for a 10W chip?
- ⤷ Are there alternative mounting options besides push-pins for this size?