công cụ tìm kiếm bảng dữ liệu linh kiện điện tử
  Vietnamese  ▼
ALLDATASHEET.VN

X  

  • ATS-06B-151-C2-R0

  • AI
    The **ATS-06B-151-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series and is designed specifically for cooling electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35mm x 35mm x 20mm | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 3.93°C/W (at 200 LFM) | | **Spring Type** | Compression Spring | | **Interface Material** | T766 (Thermal Tape/Phase Change) | --- ### 2. Key Features * **Straight Fin Design:** The "151" series features a straight-fin geometry which is ideal for systems with high-velocity airflow in a specific direction. * **Push-Pin Attachment:** It uses a push-pin mechanism with a brass or plastic pin and a compression spring. This ensures a secure fit and consistent pressure on the component for optimal heat transfer. * **Pre-Applied Thermal Interface Material (TIM):** The "C2" suffix indicates that it comes with a pre-applied thermal pad, reducing assembly time and ensuring a reliable thermal bond. * **RoHS Compliant:** The "R0" suffix confirms the part meets environmental standards for hazardous substances. --- ### 3. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 3.93 | | **400 (2.0 m/s)** | 2.36 | | **600 (3.0 m/s)** | 1.89 | | **800 (4.0 m/s)** | 1.63 | --- ### 4. Component Usage This part is typically used in: 1. **Networking Hardware:** Switches and routers where internal airflow is managed by fans. 2. **Industrial PCs:** Cooling embedded processors in compact enclosures. 3. **Power Supplies:** Managing heat for MOSFETs or bridge rectifiers that are surface-mounted.
    ✨ Follow-up Questions
    • ⤷What is the difference between the C1 and C2 thermal interface options?
    • ⤷ How do I calculate if this heat sink is sufficient for a 10W chip?
    • ⤷ Are there alternative mounting options besides push-pins for this size?