The **ATS-06B-129-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" thermal management series, specifically designed for cooling electronic components like CPUs, GPUs, and power modules. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Heat Sink Type** | Fine Pitch (straight fin) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 8.68°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 60.00mm x 60.00mm x 10.00mm | | **Weight** | 35 grams (Approx.) | --- ### Key Electronic Components & Features #### 1. Thermal Management Material The unit is crafted from high-grade aluminum. Its primary electronic function is to act as a **heat exchanger**, conducting thermal energy away from the semiconductor die and dissipating it into the surrounding air. #### 2. Fine Pitch Fin Design The "129" in the part number refers to a specific fin configuration. The fine pitch design maximizes surface area within a low-profile height (10mm). This is critical for electronics housed in tight spaces (1U or 2U servers) where vertical clearance is limited. #### 3. pushPIN™ Attachment System This mechanical assembly includes: * **Compression Springs:** Ensure consistent pressure (Force) is applied to the electronic component, optimizing the thermal interface. * **Plastic/Brass Pins:** Provide secure mounting to the PCB via pre-drilled holes. #### 4. Thermal Interface Material (TIM) The "C2" suffix typically indicates that the heat sink comes pre-applied with a high-performance **T766 thermal phase change material**. This eliminates the need for external thermal paste and ensures minimal air gaps between the component and the sink. --- ### Application in Circuitry This heat sink is typically found in: * **Telecommunications:** Cooling ASICs and FPGAs. * **Embedded Computing:** Managing heat in industrial motherboards. * **Power Electronics:** Dissipating heat from MOSFETs or IGBT modules.