The **ATS-05F-69-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for cooling high-heat-generating electronic components like CPUs, GPUs, and power transistors. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Fin Style** | Straight | | **Fin Pattern** | Fine-Pitch (increases surface area) | | **Thermal Resistance** | 11.56°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Key Design Elements #### 1. PushPIN™ Attachment System Unlike adhesive-based heat sinks, this part uses a mechanical fastening system consisting of: * **Brass/Plastic Pins:** Used to secure the sink to the PCB through pre-drilled holes. * **Compression Springs:** These provide precisely calculated "Force and Pressure," ensuring optimal contact between the heat sink base and the electronic component. #### 2. Fine-Pitch Fin Design The "69" in the part number refers to a specific fin density/configuration. The straight fins are spaced to maximize air contact while minimizing air pressure drop. This makes it ideal for systems with active fan cooling (forced convection). #### 3. Material and Finish * **Aluminum:** Lightweight and provides excellent thermal conductivity. * **Blue Anodized Finish:** This is not just aesthetic; the anodization protects the aluminum from corrosion and slightly improves heat radiation. #### 4. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a phase-change material that fills microscopic air gaps between the chip and the heat sink, significantly reducing thermal resistance. --- ### Application Use Cases This specific heat sink is typically found in: * **Telecommunications:** Networking switches and routers. * **Computing:** High-speed processors or memory modules. * **Power Electronics:** Cooling MOSFETs or Voltage Regulators.