The **ATS-05F-66-C2-R0** is a specific model of a **High-Performance Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, and other high-power semiconductors. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part number: | Property | Value / Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 25mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum | | **Fin Type** | XCUT (Cross-cut) | | **Thermal Resistance** | ~5.77 °C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the product's features: 1. **ATS-05**: Represents the series and attachment type. 2. **F**: Indicates the thermal performance level. 3. **66**: Refers to the specific fin design and layout. 4. **C2**: Indicates the material/finish (Blue Anodized Aluminum). 5. **R0**: Refers to the packaging or revision code. --- ### 3. Key Electronic Cooling Features * **pushPIN™ Attachment:** This mechanism is designed for easy installation into pre-drilled holes on a PCB. It uses a compression spring to ensure even pressure across the electronic component, optimizing heat transfer. * **Cross-Cut (XCUT) Fins:** Unlike straight fins, the XCUT design allows for airflow from multiple directions. This is ideal for electronic enclosures where airflow may be turbulent or non-linear. * **Blue Anodized Finish:** The anodized layer provides a protective coating against corrosion and slightly improves radiant heat emissivity. * **Integrated TIM:** It comes with a pre-applied **Thermal Interface Material (T766)**, which fills microscopic air gaps between the chip and the heat sink, significantly reducing thermal impedance. --- ### 4. Typical Applications This component is generally used in: * **Telecommunications:** Cooling of high-speed networking chips. * **Industrial PCs:** Thermal management for embedded processors. * **Power Supplies:** Heat dissipation for MOSFETs and power regulators.