The part number **ATS-05F-63-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components such as CPUs, GPUs, or power modules. --- ### ## Technical Specifications The following table outlines the key physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Fin Type** | Straight Fin | | **Dimensions** | 40mm x 40mm x 20mm | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 2.85 °C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### ### Component Breakdown #### 1. Heat Sink Body (40mm x 40mm) The base dimensions are standard for medium-sized chips. The **20mm height** provides a balance between high surface area for heat dissipation and a profile low enough for some 1U or 2U server chassis. #### 2. Push-Pin Attachment Unlike adhesive-based heat sinks, this model uses a mechanical **push-pin system**. * **Pros:** Provides consistent pressure on the component, improving thermal transfer. * **Installation:** Requires pre-drilled holes in the Printed Circuit Board (PCB). #### 3. Material & Coating * **Aluminum:** Lightweight and cost-effective with good thermal conductivity. * **Blue Anodized Finish:** Not only aesthetic but increases surface emissivity and provides corrosion resistance. #### 4. Thermal Interface Material (TIM) The "C2" in the part number indicates it comes with **T766** pre-applied. This is a high-performance thermal pad/paste that fills microscopic air gaps between the heat sink and the chip to ensure maximum heat flow. --- ### ### Performance Context This part is categorized under **Active or Passive Cooling** depending on the airflow (LFM - Linear Feet per Minute) in the system. * **Low Airflow (200 LFM):** ~2.85 °C/W resistance. * **High Airflow (700 LFM):** ~1.40 °C/W resistance. This means that with higher velocity air (from a fan), the heat sink becomes significantly more efficient at moving heat away from the silicon die.