The **ATS-05F-50-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic packages. Below is a detailed breakdown of its technical specifications and physical characteristics. --- ### 1. General Specifications This part belongs to the **pushPIN™** series by Advanced Thermal Solutions (ATS). It is engineered for high-efficiency heat dissipation in constrained spaces. | Feature | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the heatsink fits the specific PCB layout and the electronic component it is cooling. * **Size (L x W):** 30.00 mm x 30.00 mm * **Height:** 15.00 mm * **Pitch (Fin spacing):** Fine Pitch * **Pattern:** Cross-cut (provides multi-directional airflow efficiency) --- ### 3. Thermal Performance Thermal resistance is measured in °C/W (Degrees Celsius per Watt). A lower number indicates better cooling performance. | Airflow Velocity | Thermal Resistance (Unducted) | | :--- | :--- | | **100 LFM (0.5 m/s)** | 19.03 °C/W | | **300 LFM (1.5 m/s)** | 7.64 °C/W | | **500 LFM (2.5 m/s)** | 4.62 °C/W | --- ### 4. Key Component Features 1. **Push-Pin Mounting:** Uses a flexible attachment system with a brass or plastic pin and a stainless steel spring. This provides high assembly speed and consistent pressure on the heat source. 2. **Thermal Interface Material (TIM):** This specific model (C2) usually comes pre-applied with **T766** high-performance thermal phase change material to improve heat transfer between the chip and the aluminum. 3. **Cross-Cut Fin Design:** The "F" in the part number indicates a specific fin geometry that allows air to enter from any direction, making it ideal for systems where airflow direction might vary or be turbulent. --- ### 5. Application Usage Commonly used in: * **Networking:** Routers, switches, and base stations. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or power regulators.