ATS-05F-39-C2-R0
AI

The **ATS-05F-39-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors.
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### 1. Technical Specifications
The part number follows a specific nomenclature used by ATS to describe its physical and thermal characteristics.
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimension (Length x Width)** | 45.00mm x 45.00mm |
| **Height** | 10.00mm |
| **Fin Type** | Straight Fin |
| **Thermal Resistance** | 18.94° C/W (@ 100 LFM) |
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### 2. Key Electronic & Mechanical Components
#### A. The pushPIN™ Attachment System
Unlike standard adhesive heat sinks, this model uses a **pushPIN™** mechanism.
* **Springs:** Provides a precise amount of pressure (compression) to ensure maximum contact between the heat sink base and the electronic chip.
* **Nylon/Brass Pins:** Secure the heat sink into pre-drilled holes on the Printed Circuit Board (PCB).
#### B. Thermal Interface Material (TIM)
The "C2" in the part number indicates the type of thermal interface material pre-applied to the base:
* **Type:** T766 (High performance).
* **Function:** It fills microscopic air gaps between the electronic component and the aluminum base to lower thermal impedance.
#### C. Material Composition
* **Aluminum (6063):** Chosen for its high thermal conductivity and lightweight properties.
* **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides a small degree of electrical insulation and increases surface emissivity for better radiant heat transfer.
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### 3. Application Use Cases
This specific heat sink is typically found in:
1. **Telecommunications Equipment:** Protecting high-speed data processors.
2. **Power Electronics:** Cooling MOSFETs or Voltage Regulators.
3. **Embedded Systems:** Industrial PCs where vertical space is limited (due to its low 10mm profile).
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- ⤷
How does the 'LFM' airflow speed affect the thermal resistance of this heat sink?
- ⤷ What are the advantages of using pushPIN™ over thermal adhesive tape?
- ⤷ Can this heat sink be used on components smaller than 45x45mm?