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  • ATS-05F-39-C2-R0

  • AI
    The **ATS-05F-39-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimension (Length x Width)** | 45.00mm x 45.00mm | | **Height** | 10.00mm | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 18.94° C/W (@ 100 LFM) | --- ### 2. Key Electronic & Mechanical Components #### A. The pushPIN™ Attachment System Unlike standard adhesive heat sinks, this model uses a **pushPIN™** mechanism. * **Springs:** Provides a precise amount of pressure (compression) to ensure maximum contact between the heat sink base and the electronic chip. * **Nylon/Brass Pins:** Secure the heat sink into pre-drilled holes on the Printed Circuit Board (PCB). #### B. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of thermal interface material pre-applied to the base: * **Type:** T766 (High performance). * **Function:** It fills microscopic air gaps between the electronic component and the aluminum base to lower thermal impedance. #### C. Material Composition * **Aluminum (6063):** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides a small degree of electrical insulation and increases surface emissivity for better radiant heat transfer. --- ### 3. Application Use Cases This specific heat sink is typically found in: 1. **Telecommunications Equipment:** Protecting high-speed data processors. 2. **Power Electronics:** Cooling MOSFETs or Voltage Regulators. 3. **Embedded Systems:** Industrial PCs where vertical space is limited (due to its low 10mm profile). ---
    ✨ Follow-up Questions
    • ⤷ How does the 'LFM' airflow speed affect the thermal resistance of this heat sink?
    • ⤷ What are the advantages of using pushPIN™ over thermal adhesive tape?
    • ⤷ Can this heat sink be used on components smaller than 45x45mm?