The **ATS-05F-33-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components that generate heat during operation. Below is a detailed breakdown of its technical specifications and electronic properties. --- ### 1. Technical Specifications | Feature | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Type** | Board Level Heatsink | | **Attachment Method** | Push Pin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 17.42°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Physical Dimensions Precision is critical for board layout and ensuring the part does not interfere with neighboring electronic components. * **Length (A):** 35.00 mm * **Width (B):** 35.00 mm * **Height (C):** 20.00 mm * **Pitch (E/F):** 40.00 mm (Distance between mounting holes) --- ### 3. Electronic Design Considerations When integrating this part into a PCB design, several factors must be considered: #### A. Attachment Mechanism (Push Pin) Unlike adhesive-based heatsinks, the `ATS-05F-33-C2-R0` uses a **Push Pin** system with a compression spring. * **Benefit:** Provides consistent pressure on the component (e.g., a BGA chip), which improves thermal interface material (TIM) performance. * **Reliability:** It is more secure than thermal tape in high-vibration environments. #### B. Thermal Performance The "C2" in the part number indicates the use of a specific **Thermal Interface Material (TIM)**. This part typically comes pre-applied with **T766** phase-change material or a high-performance grease, which bridges the microscopic air gaps between the chip and the aluminum base. #### C. Airflow Profile The heatsink features a **Square Pin Fin** design. * **Omnidirectional Airflow:** Unlike straight-fin heatsinks that require air to flow in one specific direction, pin fins allow air to enter from any angle, making it ideal for crowded electronic enclosures where airflow direction is unpredictable. --- ### 4. Typical Applications * **Microprocessors (CPUs/GPUs):** For low-to-mid power chips. * **FPGAs & ASICs:** Used in telecommunications and networking gear. * **Power Supplies:** Cooling voltage regulators or power transistors.