The **ATS-05F-22-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their *pushPIN™* series, designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ## 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions** | 54.00mm x 54.00mm | | **Height** | 12.70mm | | **Fin Style** | Straight | | **Thermal Resistance** | 13.83°C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied thermal grease) | --- ## 2. Key Components & Design ### A. The Heatsink Body The main body is made of **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The "Straight-Fin" design allows for maximum airflow through the device, effectively dissipating heat from the component surface. ### B. pushPIN™ Attachment System Instead of using adhesive tape or permanent solder, this part uses a mechanical attachment system: * **Pins:** Plastic or brass pins that lock into pre-drilled holes on the PCB. * **Springs:** Provides consistent "Point-of-Contact" pressure to ensure the heatsink remains flat against the heat source. ### C. Thermal Interface Material (TIM) The base comes with **T766** pre-applied. This is a "Phase Change" or high-performance grease that fills microscopic air gaps between the chip and the metal, significantly improving heat transfer efficiency. --- ## 3. Part Number Breakdown The nomenclature reveals the specific configuration: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **05:** Series/Style. * **F:** Fin pitch/density. * **22:** Specific dimension code. * **C2:** Material/Color code (Aluminum, Blue Anodized). * **R0:** Revision or packaging code. --- ## 4. Typical Applications * **Voltage Regulator Modules (VRMs):** Managing heat in power delivery circuits. * **Processors/FPGAs:** Cooling small-to-mid-sized integrated circuits. * **Telecommunications Equipment:** Ensuring components in routers and switches stay within operational temperatures.