The **ATS-05F-199-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS Assembly | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 6.00mm | | **Attachment Method** | Push-Pin (with Compression Spring) | | **Thermal Resistance** | 15.83°C/W (at 100 LFM) | | **Fin Pattern** | Straight Fin | --- ### 2. Key Components & Construction #### A. The Heat Sink Body * **Low Profile:** Standing at only **6.00mm** high, this part is ideal for high-density applications where vertical space is limited (e.g., blade servers or compact embedded systems). * **Thermal Conductivity:** Made from Aluminum 6063, which provides a high thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization increases the surface emissivity and protects the aluminum from corrosion. #### B. The pushPIN™ Mounting System Instead of using messy adhesives or basic clips, this part uses the ATS proprietary pushPIN™ system: * **Brass Push-Pins:** Secure the heat sink to the PCB through pre-drilled holes. * **Stainless Steel Springs:** Provide precise, consistent "Force" or pressure against the electronic component to ensure an optimal thermal interface. #### C. Thermal Interface Material (TIM) * The **"C2"** in the part number indicates that the heat sink comes pre-applied with **T766 thermal grease**. This ensures immediate installation readiness and high-performance heat transfer from the chip to the metal. --- ### 3. Thermal Performance Profile The effectiveness of this part depends heavily on the airflow (measured in Linear Feet per Minute - LFM) within the device's chassis. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (Unducted)** | 15.83 | | **200 (Unducted)** | 11.48 | | **400 (Unducted)** | 9.55 | | **600 (Unducted)** | 8.18 | --- ### 4. Typical Applications * **Networking Equipment:** Switches, routers, and modems. * **Power Supplies:** Cooling voltage regulators or MOSFETs. * **Embedded Computing:** Cooling processors on Small Form Factor (SFF) boards.