The **ATS-05F-183-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, and power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Below is the breakdown of its technical profile: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 5.37°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 20.00mm | | **Flow Orientation** | Vertical Fin (Cross-cut) | --- ### 2. Key Component Features #### A. pushPIN™ Attachment System This heat sink uses a specialized **pushPIN™** system for mounting. * **Springs:** It utilizes a pre-assembled compression spring to ensure even pressure across the component. * **Plastic/Brass Pins:** These secure the heat sink to the PCB through pre-drilled holes. * **Benefits:** This provides high vibration resistance and prevents the heat sink from shifting during transport or operation. #### B. Cross-Cut Fin Design The fin structure is "cross-cut," meaning it is not just parallel lines. * This design allows for **multi-directional airflow**. * It is highly effective in systems where the air direction might change or where turbulence is required to break up the boundary layer of air, enhancing cooling efficiency. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of thermal interface. * This model typically comes with a pre-applied **T766 phase-change material** or a high-performance thermal pad. * This eliminates the need for manual application of thermal paste, ensuring a consistent and thin thermal bond. --- ### 3. Application Use-Cases This specific heat sink is typically found in: 1. **Embedded Systems:** Single-board computers or industrial controllers. 2. **Telecommunications:** Network switches and routers. 3. **Power Electronics:** Voltage regulators and high-current power modules. ---