The **ATS-05F-161-C2-R0** is a high-performance electronic thermal management component. Specifically, it is an **Advanced Thermal Solutions (ATS) push-pin heat sink** designed for cooling integrated circuits (ICs) and surface-mount components. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Product Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Brass (Compression Spring) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm | | **Thermal Resistance** | 4.74°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Design Features The part utilizes a specific "Fine Pitch" fin pattern designed to maximize surface area for heat dissipation. #### Key Components: 1. **Heat Sink Body:** Square 45mm aluminum base with vertical fins. 2. **Push-Pins:** Two plastic pins that snap into pre-drilled holes on a Printed Circuit Board (PCB). 3. **Springs:** Compression springs provide consistent downward pressure, ensuring high thermal conductivity between the chip and the heat sink. 4. **T766 TIM:** A pre-applied phase-change material or grease that fills microscopic air gaps between the component and the sink. --- ### 3. Performance Analysis (Thermal Resistance) The efficiency of this part depends on the airflow (measured in Linear Feet per Minute - LFM) within the electronic enclosure. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (Unducted)** | 4.74 | | **200 (Unducted)** | 2.57 | | **400 (Unducted)** | 1.86 | | **600 (Unducted)** | 1.54 | --- ### 4. Part Number Breakdown (Nomenclature) `ATS-05F-161-C2-R0` * **ATS:** Manufacturer prefix. * **05:** Series/Designator. * **F:** Fin pitch/Density. * **161:** Specific model/size code. * **C2:** Blue Anodized finish. * **R0:** Revision/Packaging code. --- ### 5. Application Use Cases * **BGA Cooling:** Ball Grid Array processors or chipsets. * **Networking Gear:** Cooling chips in routers, switches, and firewalls. * **Industrial PCs:** Thermal management for high-load industrial controllers.