The **ATS-05F-16-C2-R0** is a high-performance electronic thermal management component, specifically an **Aluminum Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 54mm x 54mm x 15mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 18.08°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. The pushPIN™ Attachment Unlike adhesive tapes that can fail over time, this part uses a **pushPIN™** system. * **Mechanism:** It consists of a brass or plastic pin with a compressed spring. * **Function:** It provides consistent pressure across the component surface, ensuring the best possible contact with the heat source. * **Requirement:** The PCB must have pre-drilled holes (typically 3.2mm) to accommodate the pins. #### B. Material and Finish * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides increased corrosion resistance and slightly improves "emissivity," which helps with heat radiation. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * This is a "Phase Change" or high-performance thermal pad that fills microscopic air gaps between the chip and the heat sink. * It eliminates the need for manual application of thermal paste. --- ### 3. Performance Data Thermal performance is dependent on airflow (measured in Linear Feet per Minute - LFM): | Airflow Speed (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 18.08 | | 300 (1.5 m/s) | 8.32 | | 500 (2.5 m/s) | 5.94 | | 700 (3.5 m/s) | 4.90 | --- ### 4. Typical Applications * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Networking switches and routers. * **Power Supplies:** Cooling MOSFETs and voltage regulators in high-density layouts.