The **ATS-05F-124-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its technical specifications and electronic application. --- ### 1. Technical Specifications The part belongs to the **pushPIN™** line, designed for efficient heat dissipation from surface-mount components like CPUs, GPUs, or power transistors. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Flowing)** | 1.10 °C/W (@ 100 LFM) | | **Thermal Resistance (Unducted)** | 3.29 °C/W | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 25.00mm | | **Pitch** | Fine Pitch | --- ### 2. Physical Design Features * **Fin Pattern:** It utilizes a **Cross-Cut** fin design. This allows for multi-directional airflow, making it versatile for systems where air might not flow in a single straight path. * **Attachment Mechanism:** The "pushPIN" system consists of a brass or plastic pin with a stainless steel spring. This ensures even pressure across the electronic component (TIM - Thermal Interface Material), preventing damage while maintaining maximum contact. * **C2 Designation:** This refers to the specific material/finish, which in this case is **Aluminum with a Blue Anodized finish**, providing better corrosion resistance and slightly improved radiative cooling. --- ### 3. Electronic Application This part is typically used in the following electronic environments: 1. **Telecommunications:** Cooling high-speed processors in routers or switches. 2. **Power Electronics:** Dissipating heat from MOSFETs or IGBTs in power supply units (PSUs). 3. **Embedded Systems:** Industrial PCs where space is limited but high heat dissipation is required. --- ### 4. Thermal Performance Data Electronic engineers select this part based on its performance across different airflow speeds (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 3.29 | 1.58 | 1.21 |