The **ATS-05D-80-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ## Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-05D-80-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 30mm x 30mm x 25mm | | **Thermal Resistance** | 1.88° C/W (@ 100 LFM) | | **Flow Direction** | Vertical (Push) | --- ## Key Electronic Characteristics ### 1. pushPIN™ Attachment System The "R0" suffix indicates the use of the **pushPIN™** attachment mechanism. This consists of a brass or plastic pin with a stainless steel spring. - **Benefit:** It provides a precise and repeatable force (pressure) on the electronic chip, ensuring optimal contact with the Thermal Interface Material (TIM). ### 2. Fin Design: "pushPIN™ Fine-Pitch" The fins are designed for high-density airflow. In electronic enclosures where space is limited, the fine-pitch design maximizes surface area within a small footprint (30mm x 30mm). ### 3. Thermal Interface Material (TIM) Typically, these units come pre-applied with a high-performance thermal pad or grease. This fills the microscopic air gaps between the component's surface and the heat sink base to increase thermal conductivity. ### 4. Thermal Resistance Profile The efficiency of this part is measured by its resistance to heat flow. Lower values are better: - **@ 100 LFM (Linear Feet per Minute):** 1.88° C/W - **@ 500 LFM:** 0.81° C/W *This means the heat sink becomes significantly more efficient as the fan speed (airflow) increases.* --- ## Typical Applications * **Embedded Systems:** Cooling small-form-factor processors. * **Telecommunications:** Cooling ASICs and FPGAs in networking switches. * **Power Supplies:** Dissipating heat from MOSFETs and voltage regulators.