The **ATS-05D-72-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed for cooling electronic components, specifically integrated circuits (ICs) like CPUs, GPUs, and power modules. ### 1. Technical Specifications The following table summarizes the core technical attributes of this specific part: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Thermal Resistance** | 15.97°C/W (Unducted Flow @ 100 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-pin (Brass) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Pressure Spring** | ATS-PPS-05 | --- ### 2. Key Component Features #### A. pushPIN™ Mounting System The "05D" in the part number refers to the specific push-pin attachment mechanism. This system uses a flexible, spring-loaded pin that passes through pre-drilled holes in the PCB. * **Advantage:** Provides a secure, vibration-resistant connection with consistent pressure for maximum thermal transfer. #### B. Straight Fin Design The heat sink utilizes a **Straight Fin** geometry. * **Performance:** This is optimized for environments where there is a steady, predictable airflow (forced air). The fins increase the surface area available to dissipate heat into the surrounding air. #### C. Blue Anodized Finish The surface is treated with a blue anodized coating. * **Function:** Beyond aesthetics, the anodization protects the aluminum from corrosion and slightly increases the surface emissivity, which helps with radiant heat dissipation. #### D. Thermal Interface Material (TIM) The part comes pre-applied with **T766** thermal material. * **Function:** This fills the microscopic air gaps between the component (e.g., a chip) and the heat sink base, ensuring low thermal resistance. --- ### 3. Thermal Performance Metrics Thermal resistance indicates how effectively the part moves heat away from the component. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 15.97 | | 300 (1.5 m/s) | 4.56 | | 500 (2.5 m/s) | 2.50 | | 700 (3.5 m/s) | 1.87 | --- ### 4. Typical Applications * **Computing:** Northbridge/Southbridge chips on motherboards. * **Networking:** High-speed routers and switches. * **Power Electronics:** Voltage regulators and power transistors that generate localized heat.