The **ATS-05B-07-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the "pushPIN™" series, designed for cooling various electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The table below highlights the key physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height** | 12.70 mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Pitch (Fine/Coarse)** | COARSE-PITCH | | **Thermal Resistance** | 17.00 °C/W (@ 100 LFM) | --- ### 2. Key Component Features #### A. Thermal Performance The "C2" in the part number indicates a specific thermal profile. In an airflow environment of 100 LFM (Linear Feet per Minute), it provides a thermal resistance of **17.00 °C/W**. As airflow increases (up to 700 LFM), the resistance can drop as low as **2.42 °C/W**, making it highly efficient for forced-convection cooling. #### B. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, this part uses a mechanical attachment system: * **Compression Springs:** Provide precise pressure to ensure maximum surface contact between the heat sink and the component. * **Plastic/Brass Push Pins:** Designed to snap into pre-drilled holes in the PCB (Printed Circuit Board). #### C. Fin Design This model utilizes a **cross-cut** or **straight fin** design (depending on the specific pitch variant). The coarse-pitch design is optimized for environments where there is moderate airflow, preventing dust buildup while maximizing surface area for heat dissipation. --- ### 3. Part Number Breakdown Understanding the nomenclature helps identify the electronic fit: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **05B** | Series/Mounting Style (Push-Pin) | | **07** | Profile/Height (Specific to 12.7mm) | | **C2** | Thermal Interface Material (T766/Phase Change) | | **R0** | RoHS Compliant / Revision code | --- ### 4. Implementation Example To use this in an electronic design, the PCB layout must account for the mounting hole pattern: ```yaml PCB_Requirement: Mounting_Holes: 2 Hole_Pitch: 38.00 mm (Distance between pins) Thermal_Interface: Pre-applied T766 (High performance) ```