The **ATS-05B-06-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for thermal management of electronic components such as CPUs, GPUs, and power transistors. --- ### 1. Technical Specifications The following table highlights the core technical data for this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Thermal Resistance** | 20.17 °C/W (at 0 LFM) | | **Airflow Path** | Fine Pitch (Straight Fin) | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. Straight Fin Design The "06" in the part number signifies a specific fin geometry. The straight fin design is optimized for high-performance cooling in environments where airflow is directed through the fins by a fan. #### B. Push-Pin Attachment Instead of using adhesive tape or screws, this part uses a **plastic push-pin** system. - **Benefits:** Provides consistent pressure on the electronic component, ensuring maximum heat transfer. - **Reliability:** Prevents the heat sink from shifting during vibration or mechanical shock. #### C. Material and Finish The heat sink is made of aluminum for optimal weight-to-conductivity ratio. The **Blue Anodized** finish is not just for aesthetics; it provides a layer of protection against corrosion and slightly improves radiant heat dissipation. #### D. Pre-applied TIM The unit comes with **T766 Thermal Interface Material**. This eliminates the need for manual application of thermal paste, ensuring a uniform layer that fills microscopic air gaps between the component and the heat sink. --- ### 3. Application Use Cases This part is typically found in: 1. **Networking Hardware:** High-speed routers and switches. 2. **Embedded Computing:** Industrial PC processors. 3. **Power Electronics:** Cooling for large MOSFETs or IGBT modules.