The **ATS-04H-97-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** product line, designed to provide high cooling efficiency in restricted spaces. --- ### 1. Technical Specifications Below are the primary electronic and physical specifications for this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance (LFM 200)** | 2.03 °C/W | | **Thermal Resistance (LFM 700)** | 1.31 °C/W | | **Dimensions (L x W)** | 45.00mm x 45.00mm | | **Height** | 12.70mm | | **Fin Style** | XC (Cross-Cut) | --- ### 2. Key Components & Design Features #### A. The Fin Geometry (XC / Cross-Cut) The "XC" designation refers to the cross-cut fin pattern. Unlike straight-fin heat sinks, this design allows for **multi-directional airflow**. This is critical in modern electronic enclosures where air may not flow in a perfectly linear path. #### B. The pushPIN™ Attachment System This part uses a specialized attachment mechanism rather than thermal adhesive: * **Secure Fit:** Provides high pressure to ensure optimal contact between the heat sink and the electronic component (CPU, GPU, or ASIC). * **Compression Springs:** Built-in springs provide consistent force to prevent the heat sink from shifting during vibration or shipping. #### C. Thermal Performance The efficiency of this part is measured in **°C/W** (degrees Celsius per Watt). * A resistance of **2.03 °C/W** at 200 LFM (Linear Feet per Minute) means that for every Watt of heat generated by the electronic chip, the chip's temperature will rise 2.03°C above the ambient air temperature. --- ### 3. Application Use Cases The ATS-04H-97-C2-R0 is typically used for cooling: 1. **High-Speed Processors:** Small form factor CPUs. 2. **FPGA/ASICs:** In networking equipment and routers. 3. **Power Electronics:** Large MOSFET arrays or power converters. 4. **Telecommunications:** Systems requiring high reliability and secure physical mounting. --- ### 4. Part Number Breakdown ```text ATS - 04 - H - 97 - C2 - R0 | | | | | | | | | | | +-- Revision Code | | | | +------- Performance/Finish (Blue Anodized) | | | +------------ Sequence Number (Internal) | | +---------------- Fin Height/Series | +--------------------- Number of Fins/Configuration +-------------------------- Manufacturer (Advanced Thermal Solutions) ```