ATS-04H-91-C3-R0
AI

The **ATS-04H-91-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Product Type** | Heat Sink (Push Pin Attachment) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 6.27°C/W (at 200 LFM) |
| **Dimensions** | 40mm x 40mm x 10mm |
| **Fin Style** | Straight (High-density fin pattern) |
| **Attachment Type** | Push-Pin (Brass, 2-pin) |
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### 2. Major Components and Design Features
#### A. The Heat Sink Body
The body is made of **Aluminum 6063**, which is the industry standard for thermal conductivity and weight. The blue anodized coating is not just for aesthetics; it provides surface protection against corrosion and increases thermal emissivity.
#### B. Push-Pin Attachment Mechanism
Instead of using messy adhesives or thermal tape, this model uses a mechanical **Push-Pin** system:
* **Spring-loaded:** Ensures consistent pressure between the heat sink and the chip.
* **Secure Fit:** Reduces the risk of the heat sink shifting during vibration or shipping.
#### C. High-Performance Thermal Interface Material (TIM)
The "C3" in the part number indicates that it comes pre-applied with **Phase Change Material (PCM)**. This material melts at operating temperatures to fill microscopic air gaps between the component and the heat sink, significantly improving heat transfer.
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### 3. Thermal Performance Profile
Thermal resistance is measured in Celsius per Watt (°C/W). The lower the number, the more efficient the cooling.
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 200 | 1.0 | 6.27 |
| 400 | 2.0 | 3.52 |
| 600 | 3.0 | 2.65 |
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### 4. Typical Applications
* **Processors (BGA/FPGA):** Small to medium-sized chips requiring active or passive cooling.
* **Power Supplies:** Cooling voltage regulators.
* **Networking Gear:** Used in routers and switches where airflow is directed through the chassis.
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How does the push-pin attachment compare to thermal adhesive tape?
- ⤷ What is the significance of the 'Blue Anodized' finish on thermal performance?
- ⤷ Can this heat sink be used for components larger than 40mm x 40mm?