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  • ATS-04H-91-C3-R0

  • AI
    The **ATS-04H-91-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink (Push Pin Attachment) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 6.27°C/W (at 200 LFM) | | **Dimensions** | 40mm x 40mm x 10mm | | **Fin Style** | Straight (High-density fin pattern) | | **Attachment Type** | Push-Pin (Brass, 2-pin) | --- ### 2. Major Components and Design Features #### A. The Heat Sink Body The body is made of **Aluminum 6063**, which is the industry standard for thermal conductivity and weight. The blue anodized coating is not just for aesthetics; it provides surface protection against corrosion and increases thermal emissivity. #### B. Push-Pin Attachment Mechanism Instead of using messy adhesives or thermal tape, this model uses a mechanical **Push-Pin** system: * **Spring-loaded:** Ensures consistent pressure between the heat sink and the chip. * **Secure Fit:** Reduces the risk of the heat sink shifting during vibration or shipping. #### C. High-Performance Thermal Interface Material (TIM) The "C3" in the part number indicates that it comes pre-applied with **Phase Change Material (PCM)**. This material melts at operating temperatures to fill microscopic air gaps between the component and the heat sink, significantly improving heat transfer. --- ### 3. Thermal Performance Profile Thermal resistance is measured in Celsius per Watt (°C/W). The lower the number, the more efficient the cooling. | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 6.27 | | 400 | 2.0 | 3.52 | | 600 | 3.0 | 2.65 | --- ### 4. Typical Applications * **Processors (BGA/FPGA):** Small to medium-sized chips requiring active or passive cooling. * **Power Supplies:** Cooling voltage regulators. * **Networking Gear:** Used in routers and switches where airflow is directed through the chassis.
    ✨ Follow-up Questions
    • ⤷ How does the push-pin attachment compare to thermal adhesive tape?
    • ⤷ What is the significance of the 'Blue Anodized' finish on thermal performance?
    • ⤷ Can this heat sink be used for components larger than 40mm x 40mm?