The **ATS-04H-87-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for cooling high-power semiconductors and electronic components. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 2.72°C/W @ 200 LFM | | **Dimensions (L x W x H)** | 36.83mm x 46.45mm x 24.89mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Style** | Straight (maxiFLOW™ design) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ## 2. Key Electronic Functions While the heat sink itself is a passive mechanical part, its role in an electronic circuit is critical for the survival of active components: ### A. Heat Dissipation The primary function is to increase the surface area of the heat-generating component (such as a BGA processor, FPGA, or Power MOSFET). This allows for more efficient heat transfer from the silicon die to the ambient air. ### B. Thermal Interface Material (TIM) The "C3" in the part number indicates the presence of **T412** thermal tape. This is an electrically non-conductive, thermally conductive material that fills microscopic air gaps between the component and the heat sink to ensure maximum thermal conductivity. ### C. Mechanical Attachment (pushPIN™) The part uses a specialized **pushPIN™** system. This ensures: * **Constant Pressure:** Prevents damage to delicate BGA solder balls by maintaining even downward force. * **Secure Fit:** Vibration-resistant mounting suitable for industrial and networking hardware. --- ## 3. Comparison of Airflow Performance Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 2.72 | | 400 (2.0 m/s) | 2.02 | | 600 (3.0 m/s) | 1.68 | --- ## 4. Typical Applications * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and processing modules. * **Power Electronics:** Voltage regulators and high-current power supplies. ---