The **ATS-04H-86-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and high-power chipsets. Below is a detailed breakdown of its specifications and features. ### 1. General Specifications | Feature | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-04H-86-C3-R0 | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | Push Pins (Plastic/Brass) | | **Thermal Interface** | T412 (Phase-change material) | | **Shape** | Square (XC Cut) | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the heat sink fits within the clearance constraints of a Printed Circuit Board (PCB). * **Size:** 35mm x 35mm * **Height:** 15mm * **Fin Style:** Straight fin / Cross-cut (designed for multi-directional airflow). --- ### 3. Thermal Performance Thermal resistance determines how effectively the component dissipates heat. The lower the $^\circ \text{C/W}$ value, the better the cooling. | Airflow Velocity (LFM) | Thermal Resistance ($^\circ \text{C/W}$) | | :--- | :--- | | 200 (1.0 m/s) | 5.71 | | 400 (2.0 m/s) | 3.51 | | 600 (3.0 m/s) | 2.80 | --- ### 4. Key Components & Features #### A. Attachment System (Push Pins) Unlike adhesive tapes, this model uses a **spring-loaded push-pin system**. * **Reliability:** Provides constant pressure (preload) for better thermal contact. * **Installation:** Requires pre-drilled holes in the PCB. #### B. Thermal Interface Material (TIM) The part comes pre-applied with **T412**. This is a high-performance thermal pad/paste that melts at operating temperatures to fill microscopic air gaps between the chip and the heat sink. #### C. Cross-Cut Fin Design The fins are not just parallel lines; they are "cross-cut" (square pins/blocks). This allows airflow from any direction (omnidirectional) to effectively cool the part, making it ideal for enclosures with complex air currents. --- ### 5. Application Use Cases * **Network Switches/Routers:** For cooling ASICs. * **Embedded Systems:** High-heat microcontrollers. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators.