The **ATS-04H-84-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs) such as CPUs, GPUs, and power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 30.00mm x 30.00mm | | **Height** | 25.00mm | | **Fin Style** | Straight (Push-Pin) | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Key Features and Components #### A. Fin Design: pushPIN™ Technology The "04H" series utilizes high-density fin structures designed to maximize surface area within a small footprint. This allows for efficient heat transfer from the base plate to the surrounding air. #### B. Attachment Mechanism (Push-Pin) Instead of adhesive tapes, this part uses **brass push-pins** with a compression spring. - **Reliability:** Provides constant pressure for better thermal contact. - **Ease of Use:** Fits into pre-drilled holes on a PCB (Printed Circuit Board) with a standard hole pattern (e.g., 20.00mm spacing for this size). #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. - This is a high-performance phase-change material or grease that fills microscopic air gaps between the chip and the heat sink. --- ### 3. Thermal Performance Profile Thermal resistance is measured in °C/W (Degrees Celsius per Watt). Lower values indicate better performance. | Airflow Rate (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 LFM | 0.5 m/s | 6.96 | | 300 LFM | 1.5 m/s | 2.13 | | 500 LFM | 2.5 m/s | 1.55 | --- ### 4. Implementation Example If you are integrating this into a PCB design, your CAD library should reflect the following: ```yaml Component: Heat Sink Manufacturer_Part_Number: ATS-04H-84-C2-R0 Mounting_Holes: 2x 3.0mm diameter Hole_Spacing: 20.00mm (check datasheet for exact tolerances) Orientation: Parallel to airflow for maximum efficiency ```