The **ATS-04H-81-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications The following table outlines the physical and thermal characteristics of this specific model: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 20.00mm | | **Fin Style** | Push-Pin (maxiFLOW™) | | **Thermal Resistance** | 14.03°C/W (Natural Convection) | | **Attachment Method** | Plastic Push-Pin with Brass Spring | --- ### Key Features 1. **maxiFLOW™ Geometry**: The heat sink features a unique fin pattern that increases the surface area for heat radiation while maintaining a low pressure drop. This is critical for airflow efficiency in tight electronic enclosures. 2. **Push-Pin Attachment**: It utilizes a specialized push-pin system for quick and secure mounting onto a Printed Circuit Board (PCB). This reduces labor time during assembly. 3. **Pre-applied Thermal Interface Material (TIM)**: Most units in this series come with high-performance thermal tape or grease pre-applied to the base to ensure optimal heat transfer between the chip and the aluminum. 4. **Blue Anodized Coating**: Beyond aesthetics, the anodized finish provides corrosion resistance and increases surface emissivity for better radiant heat loss. --- ### Performance Data Thermal resistance depends heavily on the airflow speed (Measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 LFM** | 4.40 | | **400 LFM** | 3.20 | | **600 LFM** | 2.50 | | **800 LFM** | 2.10 | --- ### Typical Applications * **Networking Equipment**: Routers, switches, and high-speed modems. * **Power Supplies**: Dissipating heat from MOSFETs or voltage regulators. * **Embedded Systems**: Cooling microcontrollers or FPGAs in industrial environments.