The **ATS-04H-80-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring Loaded) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 15.00mm | | **Thermal Resistance** | 7.21 °C/W (@ 100 LFM) | | **Fin Pattern** | Square-Cut (Cross-Cut) | | **Compliance** | RoHS and REACH Compliant | --- ### 2. Key Features and Design The part is part of the **pushPIN™** Heat Sink Assembly line, which focuses on ease of installation and high pressure for better thermal contact. * **Fin Style:** It uses a cross-cut (pedestal) fin pattern. This design allows for multidirectional airflow, making it versatile for systems where air might not flow in a single straight line. * **Attachment Mechanism:** It utilizes a **pushPIN™** system with a specific spring and brass/plastic pin. This ensures consistent pressure against the component, which is critical for the effectiveness of the Thermal Interface Material (TIM). * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T412**, a high-quality thermal tape or grease, ensuring efficient heat transfer from the chip to the aluminum fins. --- ### 3. Part Number Breakdown (Nomenclature) Understanding the code **ATS-04H-80-C3-R0**: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **04:** Part of the pushPIN™ series family. * **H:** High-performance thermal characteristic. * **80:** Specific dimensional/fin configuration code. * **C3:** Finish/Material code (Blue Anodized). * **R0:** Revision/Packaging indicator. --- ### 4. Typical Applications * **Embedded Systems:** For cooling microprocessors in industrial PCs. * **Telecommunications:** Cooling of high-speed data chips. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.