The **ATS-04H-50-C2-R0** is a specific model of a high-performance **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | push-PIN™ | | **Dimensions (L x W x H)** | 35mm x 35mm x 15mm | | **Thermal Resistance** | 19.03 °C/W (Unducted Flow @ 100 LFM) | | **Fin Pattern** | Fine-Pitch (Cross-Cut) | --- ### 2. Key Components & Design Features #### A. Thermal Interface Material (TIM) The part typically comes pre-applied with **ATS-CPV2**, which is a high-performance thermal phase-change material. This ensures maximum heat transfer between the component surface and the aluminum base. #### B. push-PIN™ Attachment Unlike adhesive tapes that can fail over time, this part uses a mechanical **push-pin** system. * **Springs:** Provides consistent pressure (load) to the component. * **Engagement:** Requires pre-drilled holes in the PCB (Printed Circuit Board). #### C. Cross-Cut Fin Design The "fins" are not just straight lines; they are cut in a grid pattern. This allows for: * **Multi-directional Airflow:** It can dissipate heat effectively regardless of which way the fan is blowing. * **Increased Surface Area:** More surface area equals better heat exchange with the surrounding air. --- ### 3. Part Number Breakdown The nomenclature for ATS heatsinks follows a specific logic: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **04:** Series/Family. * **H:** High-performance fin geometry. * **50:** Specific dimension/footprint code. * **C2:** Thermal performance/Interface material code. * **R0:** Revision/Finish code (Blue Anodized). --- ### 4. Typical Applications This heatsink is commonly used on: 1. **Northbridge/Southbridge** chipsets on motherboards. 2. **FPGAs** (Field Programmable Gate Arrays) in industrial equipment. 3. **Network Switches** and high-speed routers. 4. **LED Drivers** and power conversion modules.