The **ATS-04H-46-C3-R0** is a high-performance electronic thermal management component, specifically an aluminum heat sink designed for cooling integrated circuits (ICs) and other electronic packages. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W)** | 25.00mm x 25.00mm | | **Height** | 25.00mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (with Compression Springs) | | **Thermal Resistance** | 11.87 °C/W @ (1.0 m/s airflow) | --- ### 2. Key Components & Construction The "electronic parts" of this assembly include the mechanical interface and the thermal interface material (TIM) used to bridge the gap between the heat sink and the silicon chip. #### A. The Heat Sink Body Manufactured from lightweight aluminum, the body uses a **Straight Fin** design. This pattern is optimized for "forced air" cooling (where a fan is present), allowing air to flow through the channels to dissipate heat from the base. #### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, this model uses a mechanical mounting system: * **Push-Pins:** Plastic or brass pins that lock into pre-drilled holes in the Printed Circuit Board (PCB). * **Compression Springs:** These provide consistent pressure (clamping force) to ensure maximum contact between the chip and the heat sink. #### C. Thermal Interface Material (TIM) The "C3" in the part number indicates that it comes pre-applied with **T412** thermal tape or a similar high-performance phase-change material. This material fills microscopic air gaps between the CPU/GPU and the metal heat sink. --- ### 3. Application Use Cases This specific size (25mm x 25mm) is typically used for cooling the following types of electronic components: * **Northbridge/Southbridge** chipsets on motherboards. * **FPGAs** (Field Programmable Gate Arrays) in networking gear. * **Voltage Regulator Modules (VRMs)** in power supplies. * **Embedded Processors** in industrial IoT devices. ---