The **ATS-04H-41-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic integrated circuits (ICs) such as CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions** | 45mm x 45mm x 25mm | | **Thermal Resistance** | 10.07°C/W (Unducted Flow @ 100 LFM) | | **Fin Configuration** | Fine Pitch (Straight Fin) | --- ### 2. Design and Construction The "electronic parts" of this assembly are mechanical in nature but critical for the electrical longevity of a system: * **Heat Sink Body:** Extruded aluminum designed with a specific fin density to maximize surface area for convective cooling. * **Push-Pin Mounting:** This model uses brass push-pins with a compression spring. This ensures consistent "TIM" (Thermal Interface Material) pressure against the electronic chip, which is vital for efficient heat transfer. * **Thermal Interface Material (TIM):** This specific part number typically comes with **T412** pre-applied. T412 is a high-performance thermal tape/pad that fills microscopic air gaps between the heat sink and the electronic component. --- ### 3. Part Number Breakdown Understanding the nomenclature helps identify its specific electronic application: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **04** | Series/Pin Style (Push-Pin) | | **H** | Fin Height / Profile Type | | **41** | Specific Dimension Code (45mm footprint) | | **C3** | Thermal Interface Material (T412) | | **R0** | Revision/Packaging Code | --- ### 4. Application in Electronics The ATS-04H-41-C3-R0 is used in environments where electronic components are at risk of thermal throttling or failure. * **PCB Mounting:** It requires two pre-drilled holes in the PCB (Printed Circuit Board). * **Airflow:** It is optimized for systems with active cooling (fans), as the fine-pitch fins require forced air to move heat away effectively.