ATS-04H-39-C2-R0
AI

The **ATS-04H-39-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** Heat Sink series, designed for thermal management of electronic components like CPUs, GPUs, or power transistors.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimension (Length/Width)** | 45mm x 45mm |
| **Height** | 12.7mm |
| **Thermal Resistance** | 18.94 °C/W (at 100 LFM) |
| **Fin Pattern** | Straight Fin |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Design Features
#### Thermal Management
* **Performance:** The "C2" in the part number indicates high-performance thermal characteristics designed for mid-range heat dissipation.
* **Fin Geometry:** It utilizes a **straight-fin** design which is optimized for airflow from a specific direction (unidirectional).
#### Mounting System (pushPIN™)
* **Ease of Install:** Uses a push-pin mechanism with a compression spring. This ensures consistent pressure on the electronic chip, which improves heat transfer through the Thermal Interface Material.
* **Stability:** The spring-loaded pins prevent the heat sink from shifting during vibration or shipping of the electronic device.
#### Material and Finish
* **Aluminum Construction:** Offers a lightweight solution with high thermal conductivity.
* **Blue Anodized:** The coating protects against corrosion and provides a professional aesthetic finish often used in server and networking hardware.
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### 3. Common Applications
This part is typically found in the following electronic environments:
1. **Networking Hardware:** Switches, routers, and high-speed modems.
2. **Embedded Systems:** Industrial PCs and single-board computers.
3. **Power Electronics:** Voltage regulators and motor drivers that require compact cooling.
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What is the difference between T766 and other thermal interface materials?
- ⤷ How do I calculate if the 18.94 °C/W thermal resistance is sufficient for my chip?
- ⤷ Are there different spring tension options for the pushPIN system?