The **ATS-04H-32-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ## Technical Specifications | Property | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 21.46°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 35mm x 35mm x 15mm | | **Weight** | 35 grams | --- ## Key Electronic Features ### 1. Fin Design (Cross-Cut) The unit features a **cross-cut fin pattern**. This allows for "multi-directional" airflow, meaning it can dissipate heat effectively even if the air is not blowing directly in one straight line. This is critical in cramped server chassis or desktops where airflow is turbulent. ### 2. pushPIN™ Attachment Unlike adhesive tapes that can fail over time due to heat cycles, this part uses a **mechanical push-pin system**. * **Springs:** Provides consistent pressure (force) to ensure a tight bond between the component and the heatsink. * **Reliability:** Ensures the heatsink does not shift during shipping or vibration. ### 3. Pre-applied Thermal Interface Material (TIM) The part comes with **T766 thermal phase-change material**. This eliminates the need for manual application of thermal paste, ensuring an even spread and optimal heat transfer from the electronic chip to the aluminum fins. ### 4. Material and Finish * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodizing:** Beyond aesthetics, the anodized coating provides surface protection against corrosion and slightly improves heat radiation. --- ## Application Use Cases * **Telecommunications:** Cooling line cards and routers. * **Industrial PC:** Thermal management for embedded controllers. * **Power Supplies:** Heat dissipation for MOSFETs or bridge rectifiers.