The **ATS-04H-203-C2-R0** is a high-performance heat sink manufactured by Advanced Thermal Solutions (ATS). It belongs to the **push-pin** attachment family, specifically the "push-pin" series designed for secure and efficient mounting on Printed Circuit Boards (PCBs). ### 1. Technical Specifications The table below summarizes the core physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-04H-203-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 10.00mm | | **Attachment Type** | Push-Pin (Brass) | | **Fin Type** | XCUT (Straight Fins) | | **Thermal Resistance** | 8.93°C/W (Unducted Flow @ 200 LFM) | --- ### 2. Key Electronic Components & Design The "electronic" functionality of this part is passive, meaning it does not require power but is critical for the thermal management of active semiconductors (CPUs, FPGAs, ASICs). #### A. Thermal Interface Material (TIM) The part comes pre-applied with **T766**, a high-performance phase-change material. This fills the microscopic air gaps between the electronic chip surface and the heat sink base, ensuring maximum heat transfer. #### B. Mounting Mechanism (Push-Pins) Unlike adhesive-based heat sinks, the ATS-04H-203-C2-R0 uses brass push-pins with a compression spring. * **Purpose:** Provides consistent "Normal Force" (downward pressure). * **Benefit:** Prevents the heat sink from shifting during mechanical shock or vibration, which is vital for industrial or automotive electronics. #### C. Fin Geometry (XCUT) The "XCUT" design features straight fins that have been cross-cut. In electronic enclosures with variable airflow, this allows for: * Multi-directional airflow cooling. * Low pressure drop across the component. * Effective cooling even in low-speed fan environments. --- ### 3. Application Use Cases This specific heat sink is typically used for cooling the following electronic hardware: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Power Supplies:** Managing heat in VRMs (Voltage Regulator Modules). 3. **Embedded Systems:** Protecting SoCs (System on Chips) in industrial computers.