The **ATS-04H-196-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-pin (Plastic or Brass) | | **Thermal Resistance (Unducted)** | 6.17 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 4.49 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | --- ### 2. Physical Design Features The "C2" and "R0" designations in the part number refer to specific material and environmental standards: * **Heat Sink Profile:** It features a **Straight Fin** design. This is optimized for systems where there is a clear, directional airflow (forced convection). * **Push-Pin Attachment:** This model uses the **pushPIN™** system, which consists of a spring-loaded pin. This ensures consistent pressure on the electronic component (TIM - Thermal Interface Material) for maximum heat transfer efficiency. * **Material (Aluminum):** Provides a lightweight solution with high thermal conductivity. The **Blue Anodized** coating protects the aluminum from corrosion and slightly improves radiative heat transfer. --- ### 3. Decoding the Part Number The part number can be broken down to understand the component's characteristics: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **04** | Attachment type (Push-pin size/style) | | **H** | Fin pitch / Thermal performance class | | **196** | Specific dimensions/footprint code | | **C2** | Thermal Interface Material (Pre-applied T766 phase-change material) | | **R0** | RoHS compliant / Revision status | --- ### 4. Implementation Considerations When integrating this part into a PCB design, keep the following in mind: * **Airflow Direction:** Straight fin heat sinks are sensitive to airflow direction; the fins must be aligned parallel to the fan's exhaust for best results. * **Clearance:** Ensure the 10mm height does not interfere with neighboring components or the device chassis. * **Pre-applied TIM:** The "C2" version comes with a pre-applied thermal interface material, meaning no additional thermal paste is required during the first installation.