The **ATS-04H-191-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "push-pin" attachment series designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Thermal Resistance** | 2.90 °C/W (at 200 LFM) | | **Flow Orientation** | Vertical / Lateral (High-Performance Fin Array) | --- ### 2. Design and Component Breakdown #### A. Fin Geometry (The "Heat Dissipator") The "191" in the part number refers to the specific fin density and arrangement. This model features a **straight-fin** design which is optimized for forced air cooling (fan-driven). The 30mm height provides a large surface area for heat transfer while maintaining a relatively small footprint. #### B. Push-Pin Mounting System Instead of using messy thermal adhesives or tapes, this part uses a mechanical fastening system: * **Push-Pins:** Two pins go through pre-drilled holes in the Printed Circuit Board (PCB). * **Compression Springs:** These apply consistent pressure between the heat sink and the chip, ensuring maximum thermal contact and preventing the sink from shifting due to vibration. #### C. Thermal Interface Material (TIM) The "C2" designation typically indicates that the part comes pre-applied with **ATS-specific thermal grease** or a phase-change material. This eliminates the need for manual application and ensures there are no air gaps between the component and the heat sink. --- ### 3. Application Use Cases This specific heat sink is commonly used in the following electronic environments: * **Networking Gear:** Cooling high-speed switches, routers, and modems. * **Industrial PC (IPC):** Cooling processors or FPGAs in automation equipment. * **Embedded Systems:** High-power modules where passive cooling is insufficient and airflow is present. --- ### 4. Thermal Performance Data *Measured in Degrees Celsius per Watt (°C/W):* * **@ 200 LFM (Linear Feet per Minute):** 2.90 °C/W * **@ 400 LFM:** 1.68 °C/W * **@ 600 LFM:** 1.35 °C/W *Note: Lower numbers indicate better cooling efficiency as airflow increases.*