The **ATS-04H-19-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for securing cooling solutions directly to Printed Circuit Boards (PCBs). ### 1. Technical Specifications The following table summarizes the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-04H-19-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 20.00mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 9.77°C/W (at 100 LFM) | | **Fin Pattern** | Straight Fin | --- ### 2. Key Components & Design Features #### A. The Heat Sink Body The body is made of **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The blue anodized coating is not just for aesthetics; it provides corrosion resistance and slightly improves emissivity for radiant heat transfer. #### B. Attachment Mechanism (Push-Pins) The "R0" designation typically refers to the specific attachment kit included. * **Push-Pins:** These are spring-loaded fasteners that go through pre-drilled holes in the PCB. * **Springs:** Provide consistent pressure (Force) between the heat sink and the electronic component (CPU, GPU, or ASIC) to ensure maximum thermal contact. #### C. Thermal Interface Material (TIM) This specific model usually comes with **T766** pre-applied. This is a "phase-change" or high-performance thermal pad that fills the microscopic air gaps between the heat sink and the chip. --- ### 3. Application Use Cases This part is commonly found in the following electronic environments: * **Networking Gear:** Cooling high-speed switches and routers. * **Embedded Systems:** Industrial PCs where high vibration might occur (the push-pins keep the heat sink secure). * **Power Electronics:** Dissipating heat from large MOSFETs or voltage regulators. --- ### 4. Thermal Performance Comparison Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural) | 9.77 | | 200 | 6.32 | | 300 | 5.23 | | 400 | 4.60 |