The **ATS-04H-186-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** heat sink assembly series, designed specifically for thermal management in electronic components such as CPUs, GPUs, and power transistors. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ | | **Thermal Resistance (Flowing)** | 2.80 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 4.49 °C/W | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Weight** | 58.07 grams | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ### 2. Component Design Details #### A. Attachment Mechanism: pushPIN™ Unlike standard clip-on heat sinks, this part uses the **pushPIN™ system**. * **Compression Spring:** It utilizes a brass or plastic pin with a stainless steel spring to provide precise pressure. * **Secure Fit:** This ensures the heat sink remains in constant contact with the heat source, even during vibration or mechanical shock. #### B. Heat Sink Geometry * **Fin Pitch:** It features a **COARSE-PITCH** design. This is ideal for systems where airflow is somewhat restricted or provided by low-velocity fans. * **Pattern:** The fin layout is optimized for a **Square** footprint (45mm), which matches common high-power electronic packages. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * This eliminates the need for manual application of thermal paste. * It ensures a high degree of thermal conductivity between the electronic chip and the aluminum body of the heat sink. --- ### 3. Electronic Application Use-Cases This specific part is typically found in the following electronic environments: 1. **Industrial PCs:** Cooling processors in fan-less or low-airflow chassis. 2. **Network Switches:** Managing heat for high-speed packet processing chips. 3. **Power Supplies:** Dissipating heat from MOSFETs or IGBTs. 4. **Telecommunications:** Used on PCB boards where space is optimized but heat density is high. ---