The **ATS-04H-185-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" attachment series designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions (L x W x H)** | 40mm x 40mm x 30mm | | **Thermal Resistance** | 3.35°C/W @ 200 LFM | | **Fin Style** | Straight Fin | | **Spring Type** | Compression Spring | --- ### 2. Design and Components The ATS-04H-185-C2-R0 is engineered for specific airflow conditions and mechanical stability. #### A. Fin Geometry * **Straight Fin Design:** This model utilizes vertical fins that allow for optimal heat dissipation when there is a clear, directional path of airflow. * **Thermal Efficiency:** The height (30mm) provides a large surface area, making it suitable for boards with moderate to high vertical clearance. #### B. Attachment Mechanism (Push-Pin) * **Brass Push-Pins:** These pins are durable and provide consistent pressure across the thermal interface. * **Compression Springs:** The "R0" version typically includes a specific spring tension designed to ensure a secure fit without damaging the PCB or the silicon die. #### C. Thermal Interface Material (TIM) * **Pre-applied TIM:** Most units in this series come with **T766** phase-change material or a similar thermal pad pre-applied to the base to reduce contact resistance between the heat sink and the component. --- ### 3. Thermal Performance Profile The effectiveness of this heat sink is highly dependent on the velocity of the air (measured in Linear Feet per Minute - LFM). | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 3.35 | | 300 | 2.00 | | 400 | 1.55 | | 500 | 1.35 | --- ### 4. Typical Applications * **Embedded Systems:** Industrial PCs and automation controllers. * **Telecommunications:** High-speed routers and switches. * **Power Electronics:** Voltage regulators and power modules that require active or passive cooling within a chassis.