The **ATS-04H-181-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" thermal management line, designed specifically for cooling electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Fin Type** | Straight Fin | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 40.00 mm x 40.00 mm | | **Height** | 10.00 mm | | **Thermal Resistance** | 11.95°C/W (at 100 LFM) | | **Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Components & Features #### A. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, the "R0" series uses a pushPIN™ system. This consists of: * **Compression Springs:** Provide precise pressure to the component, ensuring maximum contact with the die. * **Brass/Plastic Pins:** Secure the heat sink through pre-drilled holes in the Printed Circuit Board (PCB). #### B. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a phase-change material designed to fill microscopic air gaps between the heat sink and the electronic chip, significantly reducing thermal impedance. #### C. Straight Fin Design The fins are arranged in a straight pattern. This design is optimized for **forced air cooling** (environments with fans), allowing air to flow through the channels and carry heat away from the copper or aluminum base. --- ### 3. Application Use Cases This specific part is typically found in the following electronic hardware: * **Networking Equipment:** Routers, switches, and bridges. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Microprocessors:** Cooling BGA (Ball Grid Array) components that generate moderate heat. --- ### 4. Part Number Breakdown (Nomenclature) `ATS - 04 H - 181 - C2 - R0` * **ATS:** Advanced Thermal Solutions (Brand) * **04:** Series/Size category * **H:** High-performance fin density * **181:** Specific dimensions and fin configuration * **C2:** Blue Anodized finish * **R0:** Revision/Packaging code ---