The **ATS-04H-176-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS) as part of their **push-pin** attachment series. This specific model is designed for cooling electronic components such as CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 4.40°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 15.0mm | | **Attachment Type** | Push-Pin (Plastic/Brass) | | **Spring Type** | Compression Spring | | **Fin Style** | Straight Fin | --- ### 2. Key Components & Electronics Integration #### A. Thermal Interface Material (TIM) This part typically comes with a pre-applied **Phase Change Material (PCM)** or a thermal pad on the base. This layer is critical in electronics as it fills microscopic air gaps between the heat sink and the electronic chip, ensuring efficient heat transfer. #### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the ATS-04H-176-C2-R0 uses a mechanical push-pin system. - **Benefits:** Provides consistent downward pressure on the electronic package, which optimizes thermal conductivity. - **Requirement:** The PCB (Printed Circuit Board) must have pre-drilled holes at specific intervals (usually 40mm or 45mm centers depending on the series) to accommodate the pins. #### C. Fin Geometry The "Straight Fin" design is optimized for **forced-air cooling** (fans). In an electronic enclosure, the orientation of these fins should align with the airflow path to minimize the pressure drop and maximize heat dissipation. --- ### 3. Common Applications * **Networking Hardware:** Switches, routers, and gateways. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Voltage regulators and power modules that generate significant localized heat. ---