The **ATS-04H-17-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 35mm x 35mm x 12.7mm | | **Attachment Method** | Push-Pin (Plastic) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 15.44 °C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Features and Components ### A. pushPIN™ Attachment System The part utilizes a specialized push-pin mechanism. This allows for: * **Fast Assembly:** Easy installation onto the PCB using pre-drilled holes. * **Uniform Pressure:** The integrated springs ensure consistent contact pressure between the heat sink base and the electronic component, maximizing heat transfer. ### B. Material and Coating * **Aluminum Construction:** Offers a high strength-to-weight ratio and excellent thermal conductivity. * **Blue Anodized Finish:** This is not just aesthetic; anodizing increases corrosion resistance and slightly improves emissivity (heat radiation). ### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This fills microscopic air gaps between the component surface and the heat sink, significantly reducing thermal resistance at the contact point. --- ## 3. Performance Analysis Thermal performance is highly dependent on airflow (LFM - Linear Feet per Minute). 1. **Low Airflow (100 LFM):** The resistance is approximately **15.44 °C/W**. 2. **High Airflow (700 LFM):** The resistance drops significantly to roughly **2.15 °C/W**, making it highly efficient in forced-air environments (fan-cooled systems). --- ## 4. Part Number Breakdown The nomenclature **ATS-04H-17-C2-R0** can be decoded as follows: * **ATS**: Advanced Thermal Solutions. * **04**: Internal series/designator. * **H**: High performance/specific fin density. * **17**: Specific dimension code (35mm x 35mm). * **C2**: Refers to the thermal interface material and spring type. * **R0**: Standard revision/RoHS compliant status.