The **ATS-04H-153-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** heat sink assembly series, designed specifically for thermal management in electronic components such as CPUs, GPUs, and other high-heat-generating ICs. ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Unducted)** | 4.05 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 2.14 °C/W @ 100 LFM | | **Attachment Hardware** | Brass / Plastic Pins & Stainless Steel Springs | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Features and Components #### A. The Fin Profile The "H" in the part number indicates a **High-Performance** fin profile. These fins are designed to maximize surface area while maintaining an optimal pressure drop, allowing for efficient heat dissipation even in restricted airflow environments. #### B. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, this part uses a mechanical fastening system: * **Push Pins:** These are inserted through pre-drilled holes in the Printed Circuit Board (PCB). * **Compression Springs:** They provide a precise and consistent downward force (pressure), ensuring that the heat sink maintains perfect contact with the electronic component. * **Reliability:** Mechanical mounting is more vibration-resistant than thermal tape or epoxy. #### C. Thermal Interface Material (TIM) The unit comes with **T766** thermal material pre-applied to the base. This material fills microscopic gaps between the heat sink and the chip, significantly reducing thermal resistance at the contact point. --- ### 3. Application Use Cases The ATS-04H-153-C2-R0 is typically used in the following electronic sectors: 1. **Telecommunications:** Cooling of networking switches and routers. 2. **Industrial PCs:** Cooling embedded processors in compact enclosures. 3. **Power Electronics:** Managing heat for MOSFETs or voltage regulators. 4. **Automotive:** Cooling control units (ECUs) where vibration resistance is critical. ---