The **ATS-04H-149-C2-R0** is a high-performance heat sink manufactured by Advanced Thermal Solutions (ATS) as part of their **pushPIN™** line. It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-speed FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Fin Type** | Blue Anodized (Cross-Cut) | | **Mounting Style** | pushPIN™ (Spring Loaded) | | **Dimensions (LxWxH)** | 35.00mm x 35.00mm x 20.00mm | | **Thermal Resistance** | 6.21 °C/W (at 100 LFM) | | **Attachment Type** | Plastic Push Pin with Brass Spring | --- ### 2. Key Design Components #### A. The Fin Profile The "C2" in the part number indicates a **fine-pitch** or specific fin density. This model uses a square, cross-cut pattern which increases surface area and allows for multi-directional airflow. This is critical for systems where the fan placement might not be perfectly aligned with the heatsink. #### B. Thermal Interface Material (TIM) The "R0" designation typically implies that the unit comes with a pre-applied **Thermal Interface Material**. This is usually a phase-change material or a high-conductivity grease that fills microscopic air gaps between the chip and the aluminum base to improve heat transfer. #### C. pushPIN™ Mounting System Instead of using adhesive tape (which can fail under high heat) or screws (which require tools), this part uses a spring-loaded push-pin system. * **Benefits:** Provides consistent pressure for optimal thermal contact and allows for easy removal/rework without damaging the PCB. --- ### 3. Performance Data Thermal resistance is measured in °C/W (Degrees Celsius per Watt). Lower numbers indicate better cooling efficiency. | Airflow Velocity (LFM) | Thermal Resistance (Unducted) | | :--- | :--- | | 100 (0.5 m/s) | 6.21 °C/W | | 300 (1.5 m/s) | 3.13 °C/W | | 500 (2.5 m/s) | 2.43 °C/W | | 700 (3.5 m/s) | 2.06 °C/W | --- ### 4. Applications This specific heatsink size (35mm) is commonly used in: * **Networking Gear:** Switches and Routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators.