The **ATS-04H-147-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **push-pin** attachment series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Fin Style** | Straight (Vertical) | | **Thermal Resistance** | 13.65°C/W @ 1.0 m/s (approx) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Design and Construction The "electronic parts" aspect of this component focuses on heat dissipation and mechanical integration: * **Heat Sink Profile:** It features a low-profile 10mm height, making it ideal for systems with limited vertical clearance (e.g., 1U servers or compact embedded systems). * **Fin Geometry:** The straight-fin design is optimized for unidirectional airflow. It maximizes the surface area to transfer heat from the silicon die to the surrounding air. * **Material Choice:** Aluminum is used for its high thermal conductivity and light weight, which reduces mechanical stress on the PCB (Printed Circuit Board). --- ### 3. Attachment Mechanism (Push-Pin) The **R0** suffix indicates the specific attachment kit used: * **Plastic Push-Pins:** These provide a secure, vibration-resistant mount to the PCB. * **Spring-Loaded:** The pins include springs to ensure consistent downward pressure on the electronic component, which is critical for maximizing the efficiency of the Thermal Interface Material (TIM). * **Ease of Assembly:** Push-pins allow for tool-less installation in high-volume manufacturing environments. --- ### 4. Thermal Performance The cooling efficiency of the ATS-04H-147-C3-R0 is dependent on the airflow (LFM - Linear Feet per Minute): | Airflow Velocity | Thermal Resistance (°C/W) | | :--- | :--- | | **Unducted (Natural)** | 13.65 | | **Ducted (1.0 m/s)** | 3.07 | | **Ducted (2.0 m/s)** | 2.15 | --- ### 5. Part Number Breakdown `ATS - 04 H - 147 - C3 - R0` * **ATS:** Manufacturer (Advanced Thermal Solutions). * **04:** Series/Family. * **H:** High-performance fin density. * **147:** Specific size/footprint code. * **C3:** Blue Anodized finish. * **R0:** Plastic push-pin attachment with specific spring tension.