The **ATS-04H-141-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the blueANODIZED series, specifically designed for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, and GPUs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm | | **Fin Type** | Fine Pitch (straight) | | **Number of Fins** | Varied (based on pitch) | | **Thermal Resistance** | 15.71 °C/W (at 100 LFM) | --- ### 2. Key Features and Components #### A. Attachment Mechanism (pushPIN™) Unlike traditional adhesive tapes, this part uses the **pushPIN™ system**. - It features a flexible spring-loaded mechanism that provides consistent pressure to the component. - This ensures optimal thermal interface material (TIM) performance and prevents the heat sink from shifting during vibration. #### B. Material and Finish - **Aluminum:** Chosen for its high thermal conductivity and lightweight properties. - **Blue Anodized Coating:** This is not just for aesthetics; the anodized finish increases surface emissivity, which improves heat dissipation through radiation and protects the aluminum from corrosion. #### C. Fin Geometry The "H" in the part number often refers to the specific fin pattern designed for high-performance airflow. The low profile (10mm height) makes it ideal for dense electronic assemblies where vertical space is limited. --- ### 3. Application Use Cases This component is typically found in: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Industrial PCs:** Providing passive or semi-passive cooling in harsh environments. 3. **Embedded Systems:** Where reliable mechanical attachment is required to survive mechanical shock. ---